The interactive command still shows the full outline but stitches only on the selected side. We have enhanced the algorithm to optionally, only stitch one side of the diff-pair trace for increased performance, which improves the results of the via pattern, especially when using stacked vias. Improved differential pair stability while moving complex viasĮxperience improved design efficiency when using via stitching with differential pairs. Also, propagate Pin/Via Thermal Overrides from reuse. Previously, ineligible objects would cause the creation process to fail, and all items would be unselected.ĭelete physical reuse (a circuit on disk) in a design if there are no reuse instances present, which allows for easy cleanup of Reuse Sources that are no longer needed in the design. You can now create new physical reuse from applicable objects, leaving ineligible objects selected, which improves the creation process when reuse contains a large set of selected items. We have continued to improve the user experience and efficiency when using physical reuse. All components defined within a variant are included in baselines and proposals, including components not yet placed on the PCB and the variant location in Teamcenter is included in baselines and proposals when the design is Teamcenter-managed.Įxport actual stack-up layer names to enable downstream tools to accurately reflect design composition by utilizing the same stack-up naming as seen within Xpedition. Now you can include full variant definition in baselines and proposals to enable further integration with NX and Teamcenter when variants exist. We have made some design creation improvements that affect predictability such as the new array component property, and we have improved focus handling when switching between schematic editor and the properties window. PADS Professional cloud ecosystem applications.Improved differential pair stability while moving complex vias.The new VX.2.12 release of PADS Professional has improvements across the following areas:
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